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preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the ap2602 are fully integrated, resistor programmable octave remote temperature switches with selectable external/internal trigger voltages setting. the thresholds are set by external resistors and thermistors with negative temperature coefficient. the ap2602 provides 4 open-drain, active low, over-temperature outputs for each 2 sensors. these switches operate with a 2.7v to 5.5v single supply. the ap2602 are available in 16-pin qfn-3x3-16 package. features ? 8 remote temperature switches set by thermistor and external resistors ? 4 open-drain active low output stages for each 2 temperature switches ? selectable external/internal trigger voltages setting ? built-in hysteresis temperature when using internal setting trigger voltage ? guaranteed output signal valid to v cc =0.8v ? qfn-3x3-16 package applications ? p temperature monitoring high-speed computers ? temperature control ? temperature alarms ? fan control ? automotives figure 1. package type of ap2602 qfn-3x3-16
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 2 pin configuration fn package (qfn-3x3-16) note 1: recommend connecting the thermal pa d to gnd for excellent power dissipation. figure 2. pin configuration of ap2602 (top view) pin description pin number pin name function 1 vtrig input of external setting trigger voltage 2 vcc power-supply input 3 gnd ground 4 sel connect sel to gnd to select external trigger voltage, while connecting sel to vcc to select internal trigger voltage. don?t leave the pin floating 5,7,8,10, 11,13,14,16 tmsnsx connect an external 1% resistor from tmsnsx to gnd to set trigger point of remote temperature sensorx 6,9,12,15 otxy __________ open-drain, active low, over-temperature output for sensor 1, 2, sensor 3, 4, sensor 5, 6, sensor 7, 8 respectively. the otxy __________ outputs are the wire-or results of sensorx and sensory ep 5678 13 14 15 16 1 2 3 49 10 11 12 pin 1 mark vtrig vcc gnd sel ot56 tmsns6 tmsns7 ot12 tmsns3 tmsns1 tmsns4 tmsns8 tmsns2 ot78 tmsns5 ot34
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of ap2602 cmp cmp with hysteresis deglitch logic cmp cmp with hysteresis deglitch logic sel vcc tmsns 1 tmsns2 vref vref gnd ot78 vtrig tmsns8 ot12 1 4 2 11 13 14 16 5 7 8 10 & 12 15 6 & 9 3
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 4 ordering information ap2602 - circuit type g1: green package tr: tape & reel fn: qfn-3x3-16 package temperature range part number marking id packing type qfn-3x3-16 -40 to 125 c AP2602FNTR-G1 b2e tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. absolute maximum ratings (note 2) parameter symbol value unit supply voltage v cc -0.3 to 6 v otxy voltage v ot -0.3 to 6 v tmsnsx, vtrig voltage v tmsnsx, v trig -0.3 to v cc +0.3 v sel voltage v sel -0.3 to 6 v output current (all pins) 20 ma input current (all pins) 20 ma operating junction temperature t j 150 c storage temperature range t stg -65 to 150 c lead temperature (soldering, 10 seconds) t lead 260 c thermal resistance ja qfn-3x3-16 68 c/w esd (machine model) 200 v esd (human body model) 2000 v note 2: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability.
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 5 recommended operating conditions parameter symbol min max unit supply voltage v cc 2.7 5.5 v operating ambient temperature range t a -40 125 c electrical characteristics v cc =2.7v to 5.5v, t a =-40c to 125c, unless otherwise specified. typical values are at t a =25c. parameter symbol conditions min typ max units supply voltage v cc 2.7 5.5 v v tmsnsx =v cc 40 100 supply current i cc v cc =3.3v otxy __________ float v tmsnsx =gnd 55 110 a v cc =5v, v sel =v cc, v th /v cc 0.244 0.25 0.256 tmsnsx input threshold v th /v cc v cc =3.3v, v sel =v cc, v th /v cc 0.24 0.25 0.26 v/v vtrig input range v trig 0 preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 6 typical performance characteristics figure 4. supply current vs. case temperature figure 5. supply current vs. case temperature figure 6. supply current vs. supply voltage figure 7. supply current vs. supply voltage -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 50 60 70 supply current ( a) case temperature ( o c) v cc =3.3v v sel =v cc v tmsnsx =3.3v v tmsnsx =0v -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 50 60 70 v cc =3.3v v sel =gnd,v trig =1v v tmsnsx =3.3v v tmsnsx =0v supply current ( a) case temperature ( o c) 2.53.03.54.04.55.05.5 0 10 20 30 40 50 60 70 supply current ( a) supply voltage (v) v sel =v cc v tmsnsx =3.3v t c =-40 o c t c =25 o c t c =150 o c 2.53.03.54.04.55.05.5 0 10 20 30 40 50 60 70 v sel =gnd v tmsnsx =0v t c =-40 o c t c =25 o c t c =150 o c supply current ( a) supply voltage (v)
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) figure 8. tmsnsx input threshold (v th /v cc ) figure 9. offset voltage between vtrig and tmsnsx vs. case temperature vs. case temperature v tmsns1 2v/div v tmsns2 2v/div v ot12 2v/div time (10 s/div) figure 10. open-drain otxy __________ output sink current figure 11. deglitch time to ot high (v sel =v cc ) vs. otxy __________ voltage (conditions: v cc =5v, v tmsns1 =0.5v to 3v, v tmsns2 =2.5v) -50 -25 0 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 offset voltage between vtrig and tmsnsx (mv) case temperature ( o c) v sel =gnd v trig =1v v cc =3.3v v cc =5v 012345 0 5 10 15 20 25 30 v cc =5v v sel =v cc v tmsnsx =0v t c =-40 o c t c =25 o c t c =150 o c otxy sink current (ma) otxy voltage (v) -50 -25 0 25 50 75 100 125 150 0.245 0.246 0.247 0.248 0.249 0.250 0.251 0.252 tmsnsx input threshold (v th /v cc ) case temperature ( o c) v sel =v cc v cc =3.3v v cc =5v
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) v tmsns1 v tmsns1 2v/div 2v/div v tmsns2 v tmsns2 2v/div 2v/div v ot12 v ot12 2v/div 2v/div time (50 s/div) time (10 s/div) figure 12. deglitch time to ot low (v sel =v cc ) figure 13. deglitch time to ot high (v sel =gnd) (conditions: v cc =5v, v tmsns1 =0.5v to 3v, (conditions: v cc =5v, v tmsns1 =0.5v to 3v, v tmsns2 =2.5v) v tmsns2 =2.5v, v trig =1v) v tmsns1 2v/div v tmsns2 2v/div v ot12 2v/div time (50 s/div) figure 14. deglitch time to ot low (v sel =gnd) (conditions: v cc =5v, v tmsns1 =0.5v to 3v, v tmsns2 =2.5v, v trig =1v)
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 9 typical application mode a figure 15. typical application of ap2602 (mode a)
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 10 typical application (continued) mode b vcc tmsns1 tmsns2 tmsns 8 vtrig sel gnd ot12 ot34 ot78 ot56 vcc gnd p ap2602 100k 100k 100k 100k r set8 r set1 r set2 thermistor 2 11 13 10 4 3 9 6 15 12 1 figure 16. typical application of ap2602 (mode b)
preliminary datasheet octave remote resistor-programma ble temperature switches ap2602 feb. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 11 mechanical dimensions qfn-33-16 unit: mm(inch) 3 . 1 0 0 ( 0 . 1 2 2 ) 2 . 9 0 0 ( 0 . 1 1 4 )
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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